Press releases

HongKong28-Jun-2021

Shenzhen Giant Microelectronics selects Rohde & Schwarz solutions on Ultra Wideband (UWB) Physical layer testing

BARCELONA, Spain, June 28, 2021, Mobile World Congress 2021 – Shenzhen Giant Microelectronics today announced to have adopted test solutions from Rohde & Schwarz for UWB Physical layer testing. Rohde & Schwarz develops UWB test solutions for R&D, certification and production, including essentials like time of flight (ToF) and angle of arrival (AoA) measurements as well as device calibration procedures...

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BARCELONA, Spain, June 28, 2021, Mobile World Congress 2021 – Shenzhen Giant Microelectronics today announced to have adopted test solutions from Rohde & Schwarz for UWB Physical layer testing. Rohde & Schwarz develops UWB test solutions for R&D, certification and production, including essentials like time of flight (ToF) and angle of arrival (AoA) measurements as well as device calibration procedures. The R&S®CMP200 radio communication tester from Rohde & Schwarz, for instance, is ideal for solving UWB challenges in production as well as in R&D. It combines the capabilities of a signal analyzer and generator in a single instrument. In combination with the Rohde & Schwarz WMT software service to implement automated wireless manufacturing testing and a wide portfolio of shielded chambers, the R&S®CMP200 offers a complete solution for transmitter, receiver, ToF and AoA measurements in conducted and radiated mode, compliant to IEEE 802.15.4a/z specifications. The R&S®SMM100A is a midrange vector signal generator covering up to 44 GHz, and the only in its class to offer a maximum RF modulation bandwidth of 1 GHz, thus meeting the requirements to generate broadband signals used by UWB devices in R&D and production.

Shenzhen Giant Microelectronics is developing a complete SoC solution for UWB including RF transceiver, baseband, integrated protocol and integrated MCU. RF transceiver has fully integrated receiver and transmitter with on-chip antenna switches and power amplifier, the transmit power is more than 10dBm for better ranging distance. No external switch or power amplifier or balun or transformer is required which significantly reduces BoM cost and size, critical for both mobile phones and wearables/tags/digital keys applications where space is commonly limited. The SoC supports up to 4 antennas for 3D angle of arrival (AoA) which immediately differentiates angle direction from front or back. The SoC has embedded an ARM Cortex-M CPU processor and run software and protocol internally in its SRAM and non-volatile memory (NVM). The SoC can operate as a stand-alone application processor when required, it also has various interfaces such as SPI, I2C, UART and GPIO to interface with external processors or sensors. The SoC has also embedded AES-128 and AES-256 as a part of secure element for UWB secure ranging application as well as independent data security and privacy protection applications. Leveraging advanced 22nm RF ULL process technology, the UWB SoC has achieved very low power consumption with compact footprint which is ideal for wearables/tags/digital keys applications.

Since 2020 Q4, Shenzhen Giant Microelectronics has been using UWB test solutions from Rohde & Schwarz to go through test topics defined for example by IEEE and the FiRa Consortium. The test cases have covered both BPRF (Base Pulse Repetition Frequency) and HPRF (Higher Pulse Repetition Frequency). Mr. Bill Zhang, CEO of Shenzhen Giant Microelectronics commented: “UWB will become a standard wireless technology seen everywhere because UWB provides unprecedented highly dependable, secure, accurate, fast and power efficient ranging and positioning. Rohde & Schwarz’s UWB tester solution has greatly facilitated us to complete UWB conformance and interoperability testing to ensure our UWB chips can be used by various sectors and vendors in the market. We will provide UWB chips as well as chiplets to meet strong market demands and promote UWB penetration and convenient and easy adoption.”. Alexander Pabst, Vice President Market Segment Wireless Communications, comments: “We at Rohde & Schwarz recognize the power of a secure and reliable UWB technology and are pleased to provide industry players worldwide with our class-leading test solutions. We work closely with FiRa to validate the R&S®CMP200 as PHY layer test platform.”

About Shenzhen Giant Microelectronics

Shenzhen Giant Microelectronics Company Limited is a leading fabless IC design house located in Shenzhen and Hong Kong. The Company has excellent experience and expertise in wireless algorithm, baseband, protocol, RF transceiver and SoC design. The Company’s major business activities are to develop and sell a series of UWB chips as well as chiplets for ranging, positioning and short range connectivity markets such as mobile phones, wearables, tags, digital keys, automobiles and IoT. The Company is an Associate Member of FiRa Consortium and follows IEEE802.15.4, IEEE802.15.4z and FiRa Consortium standards.

About Rohde & Schwarz

The Rohde & Schwarz technology group is among the trailblazers when it comes to paving the way for a safer and connected world with its leading solutions in test & measurement, technology systems, and networks & cybersecurity. Founded more than 85 years ago, the group is a reliable partner for industry and government customers around the globe. On June 30, 2020, Rohde & Schwarz had around 12,300 employees worldwide. The independent group achieved a net revenue of EUR 2.58 billion in the 2019/2020 fiscal year (July to June). The company is headquartered in Munich, Germany.

R&S® is a registered trademark of Rohde & Schwarz GmbH & Co. KG.

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FiRa is trademark of FiRa Consortium (https://www.firaconsortium.org), and Arm and Cortex are trademarks of ARM Limited (https://www.arm.com).

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