R&S®SMW-K50 TD-SCDMA Digital Standard

Key Facts

  • WCDMA 3GPP TDD LCR (TD-SCDMA) digital standard
  • Downlink and Uplink
  • SISO, MIMO and diversity
  • Graphical code domain and channel graph

Brief Description

The R&S®SMW-K50 TD-SCDMA option is in line with 3GPP TDD standard for a chip rate of 1.28 Mcps (low chip rate mode).

Key Facts

  • WCDMA 3GPP TDD LCR (TD-SCDMA) digital standard
  • Downlink and uplink: up to 16 data channels (plus special channels) per slot, seven slots per subframe, simulation of up to four cells
  • SISO, MIMO and diversity
  • Graphical code domain and channel graph
  • Setting of clipping value relative to highest peak in percent. Clipping takes place prior to baseband filtering. Clipping reduces the crest factor.

Brief Description

The R&S®SMW-K50 TD-SCDMA option is in line with 3GPP TDD standard for a chip rate of 1.28 Mcps (low chip rate mode).

R&S®SMW-K50 can simulate up to four TD-SCDMA cells with variable switching point of uplink and downlink. It features a user-configurable channel table for each slot and allows simulation of the downlink and uplink pilot timeslot. In uplink, a PRACH can also be generated.

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This declaration of consent may be withdrawn at any time by sending an email with the subject "Unsubscribe" to news@rohde-schwarz.com. Additionally, a link to unsubscribe from future email advertisements is contained in each email sent. Further details on the use of personal data and the withdrawal procedure are set out in the Statement of Privacy.

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