Electronic design and test days 2019

Electronic Design and Test Day

February 21, 2019, Munich, Germany

One day full of inspiration, knowledge and insights

This Electronic Design and Test Day offers researchers, developers, manufacturers and test equipment users an excellent opportunity to discuss technical and implementation challenges as well as best practices related to DC/DC converter design and test, power integrity, signal integrity and EMI. We will also provide an update on wireless IoT and its impact on the overall system design.

Join us at the Electronic Design and Test Day on Thursday, February 21, 2019 in Munich.

Registration is closed

Electronic design and test day 2019 technical presentations

Technical presentations

The technically focused presentations will center on the following topic clusters:

  • Closely connected: power integrity and signal integrity
  • Focal point I: DC/DC converter design and testing
  • Focal point II: ensuring power integrity – design and testing
  • Focal point III: high-speed interface design and testing
  • IoT: wireless interfaces in electronic designs

Agenda

Please download full agenda to get all detailed information.

Time Topic Speaker
9:00 - 9:10 Welcome and opening
9:10 - 9:40 Closely Connected: power integrity and signal integrity Steve Sandler (Picotest)
9:40 - 11:40 Focal point I: DC/DC converter design and test Bernd Geck (Texas Instruments)
Andreas Ibl & Stefan Stahuber (Rohde & Schwarz)
11:40 - 12:40 Lunch
12:40 - 14:40 Focal point II: ensuring power integrity - design and test Steve Sandler (Picotest)
Martin Stumpf & Andrea D’Aquino (Rohde & Schwarz)
14:40 - 15:00 Coffee break
15:00 - 17:00 Focal point III: high-speed interface design and test Hermann Ruckerbauer (EyeKnowHow)
Guido Schulze & Anja Paula (Rohde & Schwarz)
17:00 - 17:30 IOT: wireless interfaces in electronic designs Joerg Koepp (Rohde & Schwarz)
17:30 - 17:45 Wrap-up and farewell
Electronic design and test days 2019 Rohde & Schwarz experts

Our experts

At the Electronic Design and Test Day, Rohde & Schwarz will be joined by leading industry experts, who will share their first-hand experience of the following topics:

  • Bernd Geck (Texas Instruments): DC/DC converter compensation
  • Steve Sandler (Picotest): power integrity / signal integrity
  • Hermann Ruckerbauer (EyeKnowHow): DDR memory interface design

Your way to us

ROHDE & SCHWARZ GmbH & Co. KG
Headquarters
Muehldorfstrasse 15
81671 Muenchen (Munich)
Germany

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