Signal integrity analysis on PCB and interconnects

Webinar: Signal integrity analysis on PCB and interconnects

This webinar is created for engineers who work on signal integrity with digital designs. It will focus on aspects of channel influence through PCB and interconnects such as impedance mismatch, losses and frequency response on PCB material, unintended crosstalk, and resonant structures.

By reference to vector network analyzers and oscilloscopes, it will discuss typical measurements such as return and insertion loss, mode conversion, skew, impedance over time, crosstalk, and eye diagram. Measurement examples and demonstrations will be breathing life into the theory and building a preference for the best solution fit.


Dr. Alexander Kuellmer received his master's degree in Electrical Engineering and Information Technology at University Stuttgart, Germany, in 2009 and his Doctor of Engineering degree at the Technical University of Braunschweig at the institute for EMC in 2016. Since then, he has been working as an Application Engineer for digital test solutions and joined Rohde & Schwarz in 2018.

Joern Pfeifer studied Electronics Engineering at the University of Applied Sciences in Emden, Germany, and graduated with a degree in High Frequency Engineering. As an Application Engineer, he joined Rohde & Schwarz in 2016 and focuses on high speed digital design applications. He is a contributing member of the OPEN Alliance Automotive Ethernet TC9 working group.

Joern Pfeifer