Market Development Specialist – AI Data Center Solutions

Your tasks

• Interconnect Customer Engagement: Build strong relationships with key stakeholders in the interconnect market—including manufacturers of high-speed twinax cables, PCB backplanes, active electrical cables (AECs), and advanced optical connectors critical to scaling AI clusters.
• Drive VNA Adoption: Position the Rohde & Schwarz Vector Network Analyzer Portfolio (such as the R&S®ZNA and R&S®ZNB series) as the premier solution for multi-port S-parameter extraction, fixture de-embedding, and time-domain analysis.
• Portfolio Positioning: Drive the commercial adoption of specialized R&S solutions tailored for AI workloads, showcasing our flagship Rohde & Schwarz Oscilloscopes (R&S®RTP/R&S®RTO series) alongside our VNA offerings.
• Technical Interface Validation: Position R&S testing solutions across high-speed digital interfaces critical to AI performance, including PCIe Gen 6/7, DDR5/6, CXL, and high-speed Ethernet (400G/800G/1.6T protocols).
• Signal & Power Integrity Applications: Consult customers on advanced test methodologies using R&S equipment to solve physical layer limitations, high-frequency channel losses, multi-phase power rail disturbance, and complex crosstalk issues.
• Strategic Collaboration: Host technical seminars and represent the company at key industry events like the Rohde & Schwarz High-Speed Digital Test Forum to promote innovative verification frameworks for interconnect compliance.

Your qualifications

• Bachelor’s degree in Electrical Engineering, Computer Engineering, or a highly technical discipline.
• Industry Experience: Minimum of 3 years in business development, product management, or application engineering within the Test & Measurement industry or high-speed hardware sector.
• Product Familiarity: Solid understanding of multi-gigabit signal verification tools, specifically high-performance time-domain oscilloscopes and frequency-domain S-parameter measurements using VNAs.
• Domain Knowledge: Strong awareness of the physical layer testing demands for passive and active interconnects, high-speed serial buses, and data center networking fabrics.
• Remote within the US near major air hubs with preference for these locations: Bay Area, Boston, Austin. Must be able to travel domestically up to 40% and occasionally internationally.
• Competitive base salary with commission/bonus structure and benefits (details available during hiring process).
• In order to be considered, candidates must reside in the US and have US citizenship or permanent work authorization. Preferred Qualifications:
• Deep working familiarity with the Rohde & Schwarz Digital Design Testing ecosystem.
• Active network of contacts among silicon vendors, Tier-1 optical transceiver manufacturers, or interconnect compliance working groups.
• Hands-on engineering experience using vector network analyzers (VNAs), multiport matrix switches, or signal generators for fixture calibration and de-embedding.

Interested?