Rohde & Schwarz at DesignCon

DesignCon Demos and Technical Sessions

Join Rohde & Schwarz at DesignCon 2026—In Person or Online

Visit Rohde & Schwarz at DesignCon in Santa Clara, CA Feb 25th and 26th at booth 949 for hands-on demos, live technical conversations, and our latest solutions for signal integrity, power integrity, and high-speed design challenges.

Not making the trip to Santa Clara? No problem. We're sponsoring eight expert-led technical sessions—and each one will be streamed as a webinar with live Q&A.

Technical Session Speakers

Prof. Eric Bogatin

S-parameter Analysis with a Free Simulation Tool

S-parameter measurements contain more information than VNA displays reveal. This session demonstrates how to extract additional insights—including IEEE S370 similarity metrics, dispersion curves, Dk extraction, and TDR response—using an open-source analysis tool.

Speaker: Prof. Eric Bogatin — Professor at University of Colorado Boulder and author of 18 technical books on signal integrity. Over 40 years of industry experience at Bell Labs, Sun Microsystems, and Ansoft.

Eric Bogatin
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Eric Bogatin

Steve Sandler

Isolated Probes—Are They Really All That?

Isolated probes are rolling out rapidly, but how does one know when to use them? This session examines power integrity measurement challenges and provides a quantitative framework for probe selection, defining minimum characteristics required for each measurement type.

Speaker: Steve Sandler — Founder of Picotest with nearly 50 years in power system engineering. Internationally recognized lecturer and author on power integrity, PDN design, and distributed power systems.

Steve Sandler
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Steve Sandler

Jim Drewniak, Ph.D.

Fast Material Loss Characterization to 67 GHz with Delta-L

High-speed signaling protocols now require PCB material characterization to 67 GHz. This session presents a probe-based measurement methodology using GSSG probes and the Delta-L de-embedding method detailed in IPC 2.5.5.14.

Speaker: Jim Drewniak, Ph.D. — IEEE Fellow and recipient of the IEEE EMC Society's Richard R. Stoddart Award. Cofounder of the Missouri S&T EMC Laboratory and President of Clear Signal Solutions, specializing in signal and power integrity measurements.

Jim Drewniak, Ph.D.
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Jim Drewniak, Ph.D.

Prof. Chulsoon Hwang

ML-Driven PDN Design: From Pre-Layout Synthesis to Post-Layout Optimization

Modern hardware complexity and shortened design cycles demand faster PDN design methodologies. This session introduces practical machine learning applications for power distribution network synthesis and optimization that weren't possible with conventional approaches.

Speaker: Prof. Chulsoon Hwang — Associate Professor at the Missouri S&T EMC Laboratory. Author of over 200 IEEE publications and co-recipient of 10+ Best Paper Awards from DesignCon and IEEE EMC+SIPI conferences.

Prof. Chulsoon Hwang
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Prof. Chulsoon Hwang

Benjamin Dannan

Beyond the LTI Barrier: Quantitative VRM Stability from Time-Domain Step Load Measurement

Traditional Bode plots fail for non-linear VRM control loops. This session introduces SEPIA, oscilloscope-embedded software that extracts quantitative stability metrics and SPICE-compatible PDN models directly from time-domain step load measurements.

Speaker: Benjamin Dannan — DesignCon 2025 Engineer of the Year and Founder of Signal Edge Solutions. Two-time DesignCon Best Paper Award recipient specializing in signal/power integrity and advanced packaging for high-performance ASICs.

Ben Dannan
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Ben Dannan

Steve Krooswyk

Successful PCIe 6.0 and 7.0 System Design

As PCIe data rates push to 64 GT/s and beyond, system design challenges multiply. This session addresses the signal integrity and interconnect considerations essential for successful next-generation PCIe implementations.

Speaker: Steve Krooswyk — Senior Signal Integrity Design Engineer at Samtec and former PCI Express technical lead for Intel Data Center Group. Co-author of High-Speed Digital Design: Design of High-Speed Interconnects and Signaling.

Steve Krooswyk
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Steve Krooswyk

Mike Schnecker

Measuring Root Causes of Data Dependent Jitter

This presentation examines data dependent jitter (DDJ) analysis for high-speed digital signals like PCIe. As symbol rates increase and channel lengths grow, traditional oscilloscope-based methods face limitations. The session contrasts conventional approaches with signal model-based techniques that reveal DDJ root causes.

Speaker Bio: Mike Schnecker holds a BS from Lehigh University and an MS from Georgia Tech in electrical engineering. His test and measurement career spans applications, sales, and product development, with specialization in signal integrity applications using oscilloscopes and related instruments.

Mike Schnecker
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Mike Schnecker

Menlo Micro

Signal Integrity Challenges Overcome with High-Performance MEMS Switches

This session explores advanced MEMS switch technologies for high-speed digital and mmWave applications. Attendees will see live demonstrations of switches supporting over 64 Gbps and DC to 70 GHz, learning how their speed, density, and durability are transforming high-speed testing.

Speaker Bios: Stewart Yang and Ian Burke are Application Engineers at Menlo Micro. Stewart brings extensive semiconductor experience supporting global accounts across xDSL, 802.11, and satellite front-end technologies. Ian specializes in RF designs and filter development with expertise in wireless infrastructure and space applications.

Stewart Yang
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Stewart Yang

MXO 3 Oscilloscope

Win the new R&S®MXO 3 Oscilloscope at DesignCon 2026

Visit Rohde & Schwarz at DesignCon 2026 be entered to win the new R&S®MXO 3 . Stop by our booth to see the scope in action and attend our technical presentations, featuring speakers including Prof. Eric Bogatin, Steve Sandler, and Ben Dannan. The winner of the R&S®MXO 3 Oscilloscope will be announced at the R&S booth on Thursday, February 26th.

Hands-On Demos at Booth 949

Explore live demonstrations spanning power integrity, optical testing, high-frequency probing, and multi-channel compliance. Our engineers will be on hand to walk you through each setup and answer your toughest measurement questions.

  • Power Integrity: Load step analysis and power rail probing techniques with the MXO Series oscilloscopes
  • High-Frequency & Compliance: 110 GHz PCB probing, 802.3dj cable testing, and HDMI 2.2 compliance with the ZNA Series VNAs
  • Optical Testing: Time-domain optical signal analysis with the RTP164B and O/E conversion

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