Beyond the Front Panel: Advanced VNA, Jitter, and PDN Techniques

Course Description

Prof. Eric Bogatin of University of Colorado Boulder’s High Speed Digital Engineering Program and Rohde & Schwarz expert, Mike Schneker, invite you to a full day of leading presentations on advanced signal and power integrity measurement techniques. S-Parameter analysis is explored beyond the VNA front panel – using open-source tools to extract deeper insight including IEEE S370 similarity metrics, dispersion curves, Dk characterization, and variable rise-time TDR responses. On the jitter side, data-dependent jitter in high-speed signals like PCIe is examined through a signal model-based approach that overcomes the limitations of traditional oscilloscope methods and exposes root causes that conventional techniques miss.

VNA-based low-impedance measurement techniques are also covered in depth, including the 2-port method for measuring milliohm-level components such as vias, capacitors, and ferrites up to and beyond 1 GHz – with practical modeling workflows using tools like uSIMMICS. PDN stability rounds out the day, with load-step testing presented as a powerful complement to the traditional Bode plot methods for capturing non-linier instability effects from high-current loads such as FPGAs, ASICs, and SoCs.

Don’t miss this advanced seminar bridging measurement technique and practical engineering insight!

What will you learn?

• S-parameter data mining using open-source analysis tools
• IEEE S370 metrics, dispersion curves, and TDR from S-parameter data
• Signal model-based approach to measuring data-dependent jitter root causes
• 2-port VNA method for milliohm impedance measurements to 1+ GHz
• Component modeling for Vias, capacitors, and ferrites in PDN design
• Load-step testing for detecting non-linear PDN instability
• And more…

 

Agenda

9:00 AM - 12:00 PM

► S-Parameter Analysis ► Measuring Root Causes of Data dependent Jitter

12:00 PM - 1:00 PM

► Lunch, Provided by Rohde & Schwarz

1:00 PM - 4:00 PM

► Low Impedance Testing for Components ► Power Integrity & Load Step Testing